刘晓英
个人信息Personal Information
高级工程师
硕士生导师
性别:女
毕业院校:大连理工大学
学位:博士
所在单位:材料科学与工程学院
电子邮箱:xiaoyliu@dlut.edu.cn
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- [1]刘晓英, 马海涛, 罗忠兵, 赵艳辉, 黄明亮, 王来.刘晓英;马海涛;罗忠兵; 赵艳辉; 黄明亮; 王来 Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响[J],中国有色金属学报,2022,22(4):1169-1172
- [2]刘晓英, 马海涛, 王来.超细氧化物颗粒对Sn-58Bi钎料组织及性能影响[J],大连理工大学学报,2022,1:51-57
- [3]杨喜锐, 周大雨, 马晓倩, 王雪霞, 徐进, 陈国清, 侯晓多, 刘晓英, 高晓霞.Synthesis of dopant-free tetragonal zirconia nano-powders with aqueous precursor and their optica...[J],Materials Research Expresss,2018,6:15041-15041
- [4]Liang, Hailong, Xu, Jin, Wang, Xuexia, Liu, Xiaohua, Chu, Shichao, Xiaoying, Zhou, Dayu, DY (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Mat Modificat Laser Ion & Elect Beams, Dalian 116024, Peoples R China..Structure and electrical properties of pure and yttrium-doped HfO2 films by chemical solution d...[J],MATERIALS & DESIGN,2017,120:376-381
- [5]刘晓英, 徐佐省, 邹龙江, 于凤云, 季首华.高校实验技术人员的继续教育初探[J],实验室科学,2014,17(6):193-195,198
- [6]Huang, M. L., Zhou, Q., Zhao, N., Liu, X. Y., Zhang, Z. J., ML (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Reverse polarity effect and cross-solder interaction in Cu/Sn-9Zn/Ni interconnect during liquid...[J],JOURNAL OF MATERIALS SCIENCE,2014,49(4):1755-1763
- [7]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, Wang, Lai, XY (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2014,25(1):328-337
- [8]刘晓英, 赵杰, 邹龙江, 季首华.材料科学基础实验课多媒体教学及网络教学平台建设[J],中国现代教育装备,2013,19:42-43
- [9]Zhao, N., Liu, X. Y., Huang, M. L., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116085, Peoples R China..Characters of multicomponent lead-free solders[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2013,24(10):3925-3931
- [10]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning, Wang, Lai.Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging[A],2013,400-402
- [11]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning.Interfacial reactions between Sn-Ag-Cu-Fe composite solder and Cu substrate[A],2013,706-708:138-141
- [12]Huang, Mingliang, Yang, Fan, Zhao, Ning, Liu, Xiaoying.Solder Volume Effect on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and Cu Substra...[A],2013,52(1):753-758
- [13]赵宁, 黄明亮, 马海涛, 潘学民, 刘晓英.液态Sn-Cu钎料的粘滞性与润湿行为研究[J],物理学报,2013,62(8):86601-86601
- [14]Liu, Xiaoying, Huang, Mingliang, Zhao, Ning.Effect of Cu6Sn5 particles on microstructure formation and mechanical properties of Sn-58Bi sol...[A],2012,422-424
- [15]刘晓英, 马海涛, 罗忠兵, 赵艳辉, 黄明亮, 王来, Wang, L.(wangl@dlut.edu.cn).Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响[J],中国有色金属学报,2012,22(4):1169-1176
- [16]刘晓英, 马海涛, 罗忠兵, 赵艳辉, 黄明亮, 王来.刘晓英;马海涛;罗忠兵; 赵艳辉; 黄明亮; 王来 Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响[J],中国有色金属学报,,2012,22(4):1169-1172
- [17]Liu, Xiaoying, Huang, Mingliang, Wu, C. M. L., Wang, Lai, L (reprint author), Dalian Univ Technol, Dept Mat Engn, Liaoning, Peoples R China..Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2010,21(10):1046-1054
- [18]Liu, Xiaoying, Huang, Mingliang, Zhao, Yanhui, Wu, C. M. L., Wang, Lai, L (reprint author), Dalian Univ Technol, Dept Mat Engn, Dalian 116024, Liaoning, Peoples R China..The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu duri...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2010,492(1-2):433-438
- [19]黄明亮, 刘晓英.Electromigration of 300 μm diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package[A],2010,1132-1137
- [20]Ye, Song, Huang, Mingliang, Chen, Leida, Liu, Xiaoying.Electromigration of 300 mu m Diameter Sn-3.0Ag-0.5Cu Lead-Free Bumps in Flip Chip Package[A],2010,1132-1137